发明名称 CONDUCTIVE POLYCARBONATE MOLDINGS
摘要 PROBLEM TO BE SOLVED: To provide conductive polycarbonate moldings having a high conductivity at small blended amount of carbon fibrils and thus excellent in a mechanical strength such as an impact strength or the like at low cost. SOLUTION: The moldings are obtained by molding a composition wherein the carbonaceous fibrils having an average fiber diameter of 200 mm or less of 0.1-40 wt.% are compounded to a polycarbonate resin. A weight average molecular weight of the polycarbonate resin constituting the product is 30,000-45,000.
申请公布号 JP2001310994(A) 申请公布日期 2001.11.06
申请号 JP20000126110 申请日期 2000.04.26
申请人 YUKA DENSHI KK;MITSUBISHI CHEMICALS CORP 发明人 SAGISAKA KOICHI;TANAKA TOMOHIKO
分类号 B65D85/86;B29C45/00;C08J5/00;C08K3/04;C08K7/06;C08L69/00;H01B1/12;(IPC1-7):C08L69/00 主分类号 B65D85/86
代理机构 代理人
主权项
地址