发明名称 |
CONDUCTIVE POLYCARBONATE MOLDINGS |
摘要 |
PROBLEM TO BE SOLVED: To provide conductive polycarbonate moldings having a high conductivity at small blended amount of carbon fibrils and thus excellent in a mechanical strength such as an impact strength or the like at low cost. SOLUTION: The moldings are obtained by molding a composition wherein the carbonaceous fibrils having an average fiber diameter of 200 mm or less of 0.1-40 wt.% are compounded to a polycarbonate resin. A weight average molecular weight of the polycarbonate resin constituting the product is 30,000-45,000.
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申请公布号 |
JP2001310994(A) |
申请公布日期 |
2001.11.06 |
申请号 |
JP20000126110 |
申请日期 |
2000.04.26 |
申请人 |
YUKA DENSHI KK;MITSUBISHI CHEMICALS CORP |
发明人 |
SAGISAKA KOICHI;TANAKA TOMOHIKO |
分类号 |
B65D85/86;B29C45/00;C08J5/00;C08K3/04;C08K7/06;C08L69/00;H01B1/12;(IPC1-7):C08L69/00 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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