发明名称 |
Flip-chip bonding apparatus |
摘要 |
In a flip-chip bonding apparatus, a die inverting device is installed on an optical recognition device so that a vacuum suction chucking nozzle that is provided on the die inverting device can rotate in the direction of a pick-up position and in the direction of a die transfer position in an outside area of an open window of the optical recognition device, so that the bonding apparatus can be compact and has an improved precision of recognition of the amount of positional deviation of the die.
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申请公布号 |
US6311391(B1) |
申请公布日期 |
2001.11.06 |
申请号 |
US19990447997 |
申请日期 |
1999.11.23 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
FUKE SHIGERU;YOKOHAMA MASAKI;HAYATA SHIGERU |
分类号 |
H01L21/60;H01L21/00;H01L21/52;H01L21/68;H01L21/683;(IPC1-7):B23P19/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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