发明名称 |
TREATMENT APPARATUS, TREATMENT METHOD, SUBSTRATE WASHING APPARATUS, SUBSTRATE WASHING METHOD, DEVELOPMENT APPARATUS, AND DEVELOPMENT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To safely and reliably carry out scrubbing washing treatment at a low cost to wash the substrate surface of an object substrate to be treated by rubbing the surface with a scrubbing brush. SOLUTION: The scrubber washing apparatus 62 comprises a cup 64 working as a treatment container, a substrate supporting mechanism 66 installed in the inside of the cup 64, and a substrate washing mechanism 110 installed in such a manner that it can be transported in and out of the cup 64. The substrate supporting mechanism 66 includes a spin chuck 68 capable of holding a substrate G in vacuum adsorption manner and rotatable and movable up and down and a substrate supporting part 70 capable of moving up and down and for conditionally supporting the substrate G in the surrounding of the spin chuck 68. The washing mechanism 110 comprises a brush scrubber mechanism 112 and a jet scrubber mechanism 114. The brush scrubber mechanism 112 carries out scrubbing washing by scanning the substrate G while rubbing the substrate surface by rotating a cylindrical roll brush 116 having brush face. The jet scrubber mechanism 114 carries out blow washing by jetting a high pressure washing liquid JW from right above by setting one or a plurality of washing nozzles 128 toward the surface of the substrate G.
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申请公布号 |
JP2001310162(A) |
申请公布日期 |
2001.11.06 |
申请号 |
JP20010046086 |
申请日期 |
2001.02.22 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
AOKI MASAYA |
分类号 |
G02F1/13;B08B1/04;B08B3/02;H01L21/027;H01L21/304;(IPC1-7):B08B1/04 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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