发明名称 TREATMENT APPARATUS, TREATMENT METHOD, SUBSTRATE WASHING APPARATUS, SUBSTRATE WASHING METHOD, DEVELOPMENT APPARATUS, AND DEVELOPMENT METHOD
摘要 PROBLEM TO BE SOLVED: To safely and reliably carry out scrubbing washing treatment at a low cost to wash the substrate surface of an object substrate to be treated by rubbing the surface with a scrubbing brush. SOLUTION: The scrubber washing apparatus 62 comprises a cup 64 working as a treatment container, a substrate supporting mechanism 66 installed in the inside of the cup 64, and a substrate washing mechanism 110 installed in such a manner that it can be transported in and out of the cup 64. The substrate supporting mechanism 66 includes a spin chuck 68 capable of holding a substrate G in vacuum adsorption manner and rotatable and movable up and down and a substrate supporting part 70 capable of moving up and down and for conditionally supporting the substrate G in the surrounding of the spin chuck 68. The washing mechanism 110 comprises a brush scrubber mechanism 112 and a jet scrubber mechanism 114. The brush scrubber mechanism 112 carries out scrubbing washing by scanning the substrate G while rubbing the substrate surface by rotating a cylindrical roll brush 116 having brush face. The jet scrubber mechanism 114 carries out blow washing by jetting a high pressure washing liquid JW from right above by setting one or a plurality of washing nozzles 128 toward the surface of the substrate G.
申请公布号 JP2001310162(A) 申请公布日期 2001.11.06
申请号 JP20010046086 申请日期 2001.02.22
申请人 TOKYO ELECTRON LTD 发明人 AOKI MASAYA
分类号 G02F1/13;B08B1/04;B08B3/02;H01L21/027;H01L21/304;(IPC1-7):B08B1/04 主分类号 G02F1/13
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