发明名称 Device testing apparatus and test method
摘要 An IC chip testing apparatus comprising a chamber 6 having inside it a test stage 8 for testing an IC chip 22, cooling units 60, 62 able to cool the inside of the chamber 6 to a temperature less than ordinary temperature, heating units 60, 62 able to heat the inside of the chamber 6 to return it to ordinary temperature, temperature sensors 72, 74 for detecting the temperature inside the chamber 6, and a temperature controller 70 for controlling the outputs of the cooling units and/or heating units 60, 62 in accordance with the outputs from the temperature sensors. The apparatus not only makes the temperature control stop but also automatically performs ordinary temperature reset processing when an alarm signal of a temperature abnormality inside the chamber is detected. Further, the apparatus automatically performs ordinary temperature reset processing when the time of continuous operation of the device testing apparatus is more than a predetermined time. In accordance with the apparatus, condensation can be effectively prevented from occurring inside the chamber even when a temperature alarm is emitted or the testing apparatus is operated continuously for a long period of time.
申请公布号 US6313654(B1) 申请公布日期 2001.11.06
申请号 US19990339062 申请日期 1999.06.23
申请人 ADVANTEST CORPORATION 发明人 NANSAI YUICHI;MURAYAMA TAKAO;KOJIMA KATSUMI
分类号 G01R31/26;G01R31/01;G01R31/28;H01L21/66;(IPC1-7):G01R31/26;F27D11/00 主分类号 G01R31/26
代理机构 代理人
主权项
地址