Method of fabricating dual damascene structure

摘要

A method of fabricating a dual damascene is provided. A dielectric layer is formed on a substrate. A diffusion barrier layer is formed on the dielectric layer. A portion of the diffusion barrier layer and the dielectric layer is removed to form a trench and a via hole. A barrier layer is formed on the diffusion barrier layer and in the trench and the via hole. The barrier layer on the diffusion barrier layer is removed by chemical-mechanical polishing. A conductive layer is formed in the trench and the via hole by selective deposition. A planarization step is performed with the diffusion barrier layer serving as a stop layer.