SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: To provide a semiconductor device which can surely inhibit an analysis of an integrated circuit of the semiconductor element fixed to a substrate (which can surely retain confidential information about a semiconductor device), and to provide its manufacturing method. CONSTITUTION: A semiconductor device 1 is fixed (flip-chip mounted) to a substrate 3 to operate in normal only in a flat condition as well as to make a chip 2 having an integrated circuit to a flat condition. The chip 2 is given a stress by the back 2a being processed and is transformed by the above stress when it was detached from the substrate 3. The thickness of the chip 2 is preferably less than 50 μm, and more preferably, within the range of 30 μm to 50 μm.