| 摘要 |
PURPOSE: To effectively reduce useless radiation which has generated from an electronic circuit component, in a resin molded body containing the electronic circuit component operating at a high speed. CONSTITUTION: The entire surface of the resin molded body (10) which includes a semiconductor bare chip (11) inside and is molded with an epoxy resin (12) on the outside, is covered with a magnetic loss film (15). A magnetic loss film (15) may be a granular magnetic thin film, for example. In addition, several lead frames (13) extends outside from the semiconductor bare chip (11) thorough epoxy resin (12). |
