| 摘要 |
PURPOSE: A linear guide having an air bearing is provided to precisely position a semiconductor substrate by improving a driving unit of a pick and place system of a die bonder. CONSTITUTION: The linear guide includes a supporting element(2) and a carriage(3) slipping on the supporting element. The supporting element and the carriage are separated by an interval(7) through which pressured air can be supplied. At least one heating element(12) is installed so that the temperature of a portion of the supporting element and/or the carriage which affects the thickness of the interval is maintained within a predetermined error range. |
