发明名称 MANUFACTURING METHOD FOR TEMPERATURE CONTROL DEVICE
摘要 PURPOSE: To manufacture a temperature control device in which the heat transfer characteristics such as the soaking property and the responsiveness by improving the flatness are improved at a low cost. CONSTITUTION: In this manufacturing method of the temperature control device 1 comprising a temperature control element 2 in which electrodes 7, 8 are formed on surfaces facing each other of a pair of insulation substrates 5, 6 disposed facing each other and a thermoelectric element 9 is soldered between the electrodes 7, 8 facing each other and a pair of beat transfer plates 3, 4 disposed on outer surfaces of the insulation substrates 5, 6 of the temperature control element 2, the heat transfer plate 4 is disposed on the outer surface of the insulation substrate 6 after the thermoelectric element 9 is soldered thereto, the insulation substrate 6 is flexible, and the thermoelectric element 9 is soldered under a predetermined pressure by using a solder 12 with copper powder as a layer thickness control member mixed therein.
申请公布号 KR20010095294(A) 申请公布日期 2001.11.03
申请号 KR20010017817 申请日期 2001.04.04
申请人 KOMATSU LTD. 发明人 KURIYAMA KAZUYA;YASUE YOICHI
分类号 B23K1/00;B23K3/00;B23K101/40;H01L21/00;H01L21/02;(IPC1-7):H01L21/02 主分类号 B23K1/00
代理机构 代理人
主权项
地址