| 摘要 |
PROBLEM TO BE SOLVED: To provide structure that maintains the sufficient strength of a substrate in a filed effect transistor having a via hole. SOLUTION: The via hole is formed, where the via hole passes through the insulation region of a semiconductor layer and a buffer layer from the surface side of the semiconductor layer having an active region and the insulation one to a semiconductor substrate. A conductive layer is formed, where the conductive layer connects the semiconductor substrate to an electrode on the semiconductor layer via the via hole.
|
