| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding electrodes which prevents Br from penetrating into an alloy layer and reliably bonds gold wires to aluminum pads. SOLUTION: The electrode bonding method for bonding a gold wire 1 to an aluminum electrode 2 through a capillary 4 and sealing them with a bromine- containing seal 9 comprises a step of tapering the top end of the capillary 4, oxidating the surface of the aluminum electrode 2, heating this electrode 2, setting the capillary 4 having an ultrasonic source 6 to bond the gold wire 1 to the electrode 2, and growing an alloy layer 5 on other parts than bond surface periphery. A capillary 4a having a plurality of annular top ends may be used for the bonding. An aluminum oxide film 2a having a smaller area than the bond zone area of the wire 1 is removed to form an opening 2aa, and the wire 1 is bonded to the aluminum electrode 2 exposed through the opening 2aa using a capillary 4b. |
