| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light-emitting device where a mask is freely aligned on a wafer and a light-emitting element is appropriately coated with a package containing phosphor. SOLUTION: The pattern of a sub-mount element 1 is formed on a silicon wafer 5, and a light-emitting element 2 is mounted on the sub-mount element 1 in continuity, with the light-emitting element 2 sealed with a resin package 3 comprising phosphor for wavelength conversion. Here, as the silicon wafer 5, a land 5a is formed for a spacer for enlarging the interval between individual patterns in the array direction of at least one direction of the individual pattern of the sub-mount element 1, and a position corresponding to the land 5a is masked so that a phosphor paste 7 is applied by a screen printing. |
