| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board for an electronic component, which does not leave bubbles between the surfaces of photosensitive insulating resin layers and a resin film, does not hinder to an ultraviolet transmission at the time of an exposure of the wiring board, can open normal vias, can eliminate recesses in the surfaces of the photosensitive insulating resin layers subsequent to the formation of the vias and can prevent a short-circuit between wiring patterns due to a plating, and to provide the manufacturing method of the wiring board. SOLUTION: A multilayer wiring board 11 for an electronic component has a core board material 12, and a multilayer wiring 3 provided on the core board material 12 is formed with two-layer or more-layer wiring patterns 14, 19 and 22 via insulating resin layers 17 and 21. Moreover, the wiring 3 has the upper and lower wiring patterns 14, 19 and 22 made to have continuity with each other through vias 20 and 20a. In this multilayer wiring board 11, a degassing part for pushing out gas being included in the interior of the wiring board 11 is provided in a space part 32 partioning each lead of each of the patterns 14, 19 and 22 in a planar manner. |
