发明名称 SOLID-STATE IMAGE PICKUP ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup element that can extend the area rate of a light reception region in a unit pixel area, and a manufacturing method of the solid-state image pickup element. SOLUTION: A trench 14 is provided at the surface side of a substrate 11, a light reception region 17 is provided at the bottom part of the trench 14, and a charge transfer region 25 is provided on the side wall of the trench 14. The charge transfer region 25 is composed of an N-type diffusion layer 26 that is formed in the side-wall surface layer of the trench, a side-wall-like transfer electrode 27 that is formed along the side wall of the trench, and an insulating film 23 that is provided between the N-type diffusion layer 26 and the transfer electrode 27. A read region 20 using the transfer electrode 27 as a read electrode is provided between the charge transfer and light reception regions 27 and 17.
申请公布号 JP2001308309(A) 申请公布日期 2001.11.02
申请号 JP20000125951 申请日期 2000.04.26
申请人 SONY CORP 发明人 KARASAWA NOBUHIRO
分类号 H01L27/148;H01L31/10;H04N5/335;H04N5/369;H04N5/3728;(IPC1-7):H01L27/148 主分类号 H01L27/148
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