| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in removability, developability, scumming resistance, adhesion and work efficiency, a photosensitive element, a method for producing a resist pattern using the element and a method for producing a printed wiring board using the element. SOLUTION: The photosensitive resin composition contains (A) two or more binder polymers, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in one molecule and (C) a photopolymerization initiator. The component (B) contains (b1) a compound having one polymerizable ethylenically unsaturated bond and at least one phenyl or phenylene group in one molecule as an essential component. The photosensitive element is obtained by applying, drying and laminating the photosensitive resin composition on a substrate. |
