PHOTOSENSITIVE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive composition useful to form a soldering resist film and the insulating resin layers of various electronic parts. SOLUTION: The photosensitive composition consists essentially of (A) a prepolymer having both a polymerizable unsaturated group and a carboxyl group in one molecule, (B) a photopolymerization initiator, (C) a reactive diluent copolymerizable with the prepolymer (A), (D) a blocked isocyanate compound having two or more blocked isocyanato groups in one molecule and (E) an adhesion imparting agent.