| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that has a three-dimensional mounting modular structure by using a flexible circuit substrate that is superior in the ease of a three-dimensional assembly and the repair (or rework) workability. SOLUTION: In mounting regions 111, 112, 113 of the flexible circuit substrate 11, mainly electronic components 121, 122, 123 are mounted respectively and other electronic components 124, 125 are also mounted. The flexible circuit substrate 11 is configured so as to fold up each of mounting regions 111-113 above a base region 110 in a given order (f1-f3). An integrated spacer 13 is overlapped and adhered to the flexible circuit substrate 11 as shown by broken line arrows and, when each of mounting regions 111-113 is folded up, supports the laminated layer of each of electronic components 121-125. The integrated spacer 13 has a thick region 131 and a thin region 132.</p> |
