| 摘要 |
PROBLEM TO BE SOLVED: To surface mount an electronic part on a mother board by melting the solder of an electrode under a state where a shield case is secured. SOLUTION: An electronic part 2 is mounted on the surface 1A of a board 1 having an end face 1C on which an end electrode 5 is formed and fixed with a solder 6. The board 1 is provided, at the outer circumferential part forming the end face 1C thereof, with outer circumferential soldering parts 7 and, at the corner parts 1D thereof, with corner soldering parts 8 and an inner circumferential soldering part 9 is provided at an inner circumferential part formed through the board 1. Outer circumferential securing parts 10E of a shield case 10 is secured to the outer circumferential soldering parts 7 of the board 1 using a high temperature solder 11 having a melting point higher than that of the solder 6 and the corner securing parts 10F and the inner circumferential securing parts 10G of the shield case 10 are secured to the corner soldering parts 8 and the inner circumferential soldering part 9 using a low temperature solder 12 having a melting point substantially equal to that of the solder 6.
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