| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts on substrate by which the fixed quantity supply of solder can be realized by preventing the falling of solder paste. SOLUTION: A lead inserting hole H having a land LA is made in a printed board B and the solder paste SP is printed on the land LA. The paste SP is printed so that a through hole LAa having an inside diameter dSP may be formed by masking. The through hole LAa of the paste SP is formed in such a way that the center of the hole LAa is made to nearly coincide with that of the lead inserting hole H, and the inner diameter dSP of the hole LAa is made slightly larger than the inner diameter dH of the hole H. The paste SP is excessively given to the land LA. When the lead LE of lead parts D passes through the lead inserting hole H and the through hole LAa of the paste SP, the lead LE does not touch the paste SP and, accordingly, the paste SP is not removed nor deformed by the force of the lead LE.
|
