| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip-fitting device that can improve the arrangement accuracy of a semiconductor chip that is fitted in short cycle time. SOLUTION: In this semiconductor chip-fitting device, the semiconductor chip is fitted onto a substrate, specially, a metal lead frame (1), the substrate is advanced toward a bonding station in a first direction (x) step by step to prepare a next substrate position (2), and at the same time a sensor (12) is provided, where the sensor determines the position of a longitudinal-side edge (4) of the substrate to a second direction (y) vertical to the first one. In this case, the sensor (12) is equipped with a first light barrier that is formed by a light source (13) and a first light receiver (14), and a second light barrier that is formed by the light source (13) and a second light receiver (15) and operates as reference. At the same time, the substrate is arranged while the substrate partially covers the first light barrier and at the same time does not cover the second light barrier when the sensor (12) is actuated.
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