| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable the rationalization of production with a single heat process. SOLUTION: The method for manufacturing a small module wherein a chip part 22 and a bearing chip 23 coexist on the same plane of a printed board 21 comprises a flux printing process 111 for printing a flux by means of a metal mask 25 on a land 24 for the bearing chip, a cream solder printing process 112 for printing a cream solder 31 using the metal mask 29 on a land 28 for the chip part, mounting processes 113, 114 for mounting the chip part 22 and the bearing chip 23, and the heat process 115 for heating with a reflow furnace. In the metal screen 29, a recess 32 is formed at a portion corresponding to the land 24 for the bearing chip. As a result, one reflow is enough and the rationalization of production is made possible.</p> |
