| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated chip component which can prevent oxidization of an external electrode in an environment of high temperature and moisture even if Pb-free mounting using conductive adhesives is applied, as well as micro cracks producing between the conductive adhesives and external electrode, and is high in reliability and low in cost. SOLUTION: This laminated chip component is provided with external electrodes 2 and 3 which are comprised of base layers 20 and 30 that are electrically connected with internal electrodes 10a, 10b... made of base metal provided on a component elemental body 1 and contain a conductive material made mainly of copper (Cu) and a glass frit, outer layers 21 and 31 which contains a conductive material made of rare metal including a palladium (Pd) and made mainly of silver (Ag) as well as the same glass frit as the base layer, and alloy layers 22 and 32 of Cu and Pd which produce a boundary between the base layers 20 and 30 and outer layers 21 and 31.
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