| 摘要 |
PROBLEM TO BE SOLVED: To form a wiring circuit for driving a display device sealed in a glass container or the like in high density. SOLUTION: In a cathode substrate 20a which is a wiring area 11 of a COG- type display device, a first wiring pattern 31 formed by extending a cathode electrode layer 21, and a second wiring pattern formed by extending a gate electrode layer are drawn out. A part of this wiring pattern, to which an electrode 35 of an IC chip 12 is connected, forms a land part 34. Because it is different in height from the first wiring pattern 31, if it is patterned to mutually intersect, short circuit is not generated. In an electrode part 35 of the IC chip 12, adhesive cream solder balls 36 are fitted, and the IC chip is mounted on the wiring pattern by a mounter and then applied with heat. The cream solder balls 36 are melted by the heat, and the melted solder balls are spread in a space of the electrode 35 and the land part 34, thereby a mounted state for electrically connecting the land part 34 and the electrode 36 is achieved.
|
