发明名称 HIGH FREQUENCY WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a high frequency wiring board, and its production method, in which high frequency transmission characteristics can be enhanced. SOLUTION: The high frequency wiring board has a dielectric film containing polyimide resin having a repeating unit shown by formula (1), where R1 represents a tetravalent aromatic organic group, R2 represents a bivalent aromatic organic group, and R1 and/or R2 represents an aromatic organic group having no C-H bond.
申请公布号 JP2001308474(A) 申请公布日期 2001.11.02
申请号 JP20000119917 申请日期 2000.04.20
申请人 NIPPON SHOKUBAI CO LTD 发明人 TAJIRI KOZO;KONISHI MASAYOSHI;OKUMURA YASUNORI
分类号 C08G73/10;H05K1/03;(IPC1-7):H05K1/03 主分类号 C08G73/10
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