DISPLAY DRIVER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a display driver module at low cost wherein the connection process of an integrated circuit chip and a wiring pattern in a flexible substrate is shortened and the metal chassis of a display panel acts as a heat-release body. SOLUTION: By pressing the integrated circuit chip 12 having a bump electrode 18 using an anisotropic conductive film 19 or an anisotropic conductive paste or a resin paste which does not include conductive particles or a resin film which does not include conductive particles, a rear face of the integrated circuit chip 12 is adhered to the metal chassis 21 of a display panel with an integrated circuit chip adhesive 20. Thus, the display driver module for the heat-release body of the integrated circuit chip 12 is configured. The display driver module of the low cost is provided because the time of a connection process and the cost of equipment can be reduced by a collective bonding and a radiator is not required.