| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a wire becomes easier to break because of high wire resistance and also becomes deficient in reliability and the rearrangement of the wire requires labor and requires a longer design time when the wire having a wiring filling factor above an upper-limit value is made thin. SOLUTION: The wiring filling factor is checked by scanning a specific measurement area on a layout pattern of wiring. When the wire filling factor exceeds the upper-limit value, wiring intervals are automatically widened so that the wire filling factor becomes less than the upper-limit value, a wiring inhibition area is inserted between wires, wiring is divided into and replaced by plural wirings having marrow width, or part of a wire is formed in a layer through a contact hole to obtain a layout pattern whose wire filing factor is less than the upper-limit value.
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