| 摘要 |
A substrate (11) includes at least one hole provided with an optical filling (13) for connecting the optical signals. The filling (13) includes at least two different light conductive layers (131,132) in the longitudinal direction of the hole. The carrier arrangement (10) for optical components and connecting optical signals includes a substrate (11) having at least one hole (12) which is provided with an optically conductive filling (13) for connecting the optical signals. The optical filling (13) includes at least two different light conductive layers (131,132) in the longitudinal direction of the hole. Independent claims are included for; a method for manufacturing a carrier arrangement; an analyzing device comprising a carrier arrangement. |
