| 摘要 |
PROBLEM TO BE SOLVED: To protect parts which are manufactured under the soldering condition of the conventional eutectic lead solder from thermal stresses so that the parts may not be troubled nor broken, even under such a condition that the soldering must be performed at a temperature higher than the soldering temperature of the conventional eutectic lead solder at the time of performing reflow- soldering by using lead-free solder. SOLUTION: This soldering method is used at the time of mixedly mounting parts 2 having large heat capacities and parts 3 having small heat capacities on a printed wiring board 1. In the method, members 4 having large specific heat are stuck to the upper surfaces of the parts 3.
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