| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive feeder and a method of mounting electronic components which enables the high-density mounting and the high-efficiency production of electronic components. SOLUTION: The electronic component mounting method for electrically connecting electronic components to a board comprises a step of dipping in a conductive adhesive 4 the top ends of a plurality of protrusions 2 formed in the same distribution as the connection spot distribution of the electronic components and the board on one surface of a base 1, a step of contacting the top ends of the protrusions 2 to the connection spots at the board or the electronic component side and transferring the conductive adhesive 4 to the connection spots, and a step of bonding the electronic components to the board through the conductive adhesive. The adhesive feeder is used therefor.
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