APPARATUS AND METHOD OF MOUNTING SEMICONDUCTOR FOR FPC

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and method of mounting a semiconductor for FPC which permits the attachement of an ACF and provisional and proper bonding of an IC with respect to an FPC. SOLUTION: An ACF attachement unit 140 is provided with an ACF cutter to control the cutting depth of an anisotropic conductive sheet to be used in accordance with the IC mounted on the FPC 200 by means of the ACF cutter. Thus, even if the thickness of the anisotropic conductive sheet varies, only the anisotropic conductive sheet can be cut without cutting a base tape.