RESIN-SEALING METHOD OF FLIP-CHIP PACKAGE, PRINT MASK FOR RESIN SEALING USED THEREFOR, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide the resin-sealing method of a flip-chip package that cannot easily generate void remainder, can cope with an area bump chip, and has high productivity, and a print mask for resin sealing that is used for the resin sealing method, and to provide a semiconductor device that has a small amount of void remainder and excellent reliability. SOLUTION: In this resin-sealing method of the flip-chip package where the print mask is overlapped to the flip-chip packaging body, and a sealing resin is subjected to print injection around a semiconductor chip on a wiring board, air inside clearance is discharged from one side of the chip by the sealing resin that is permeated to the clearance between the wiring board and semiconductor chip. When the sealing resin is to be coated around the semiconductor chip, no sealing resin or only a small amount of sealing resin is preferably coated at one portion of the entire periphery of the chip.