发明名称 EXPOSURE METHOD AND SYSTEM, AND METHOD OF DEVICE MANUFACTURING
摘要 PROBLEM TO BE SOLVED: To enable a stage system and others to be assembled and aligned easily and efficiently. SOLUTION: Wafer stages 40A and 40B are installed on a wafer base 39 freely movably to constitute a wafer stage system WST, the wafer stage system WST is housed in a wafer chamber 38, and a wafer loader chamber 70 housing the wafer loader systems WRDA and WRDB is provided to the side of the wafer chamber 38. When a wafer W1 is delivered from a position A4 by the use of the loader system WRDA, it is aligned on the basis of its external shape at a position A3 in transit, based on a detection result by image pickup devices 83A and 84A. When the wafer W1 is delivered to the position A1 in the wafer chamber 38, it is aligned (pre-alignment) with the wafer stage 40 on the basis of its external shape again. As a result of this setup, a wafer can be delivered accurately to the wafer stage 40A, even when the wafer chamber 38 is assembled by a modular method.
申请公布号 JP2001308003(A) 申请公布日期 2001.11.02
申请号 JP20010027940 申请日期 2001.02.05
申请人 NIKON CORP 发明人 NISHI TAKECHIKA
分类号 G03F7/20;G03F9/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
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