SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device that solves a separation problem of junction caused by a stress that tears off a semiconductor element from a substrate due to the thermal expansion of resin that seals a gap between the semiconductor element and the substrate when a reflow test for mounted semiconductor devices and a high temperature sustainable environment test for the semiconductor device are conducted. SOLUTION: The semiconductor device improves reliability of electrical conduction for the junction by exerting more pressure on the surface of the junction for a projected electrode 14 formed on a semiconductor element 12 and a wire 15 of the substrate 16. The pressure on the surface can be obtained by setting Young's modulus of the second sealing resin 19 that seals the entire semiconductor element 12 and the surface of the substrate 16 larger than Young' s modulus of the first sealing resin 18 that seals the gap between the semiconductor element 12 and the substrate 16.