| 摘要 |
PROBLEM TO BE SOLVED: To mount a high density semiconductor device on an interposer or the like with a high reliability, simplify a mounting structure, facilitate a mounting work, reduce the number of mounting processes, and increase an yield to provide a semiconductor device at a low cost, and facilitate the replacement after mounting, etc. SOLUTION: The semiconductor device 3 comprises a semiconductor chip 11, Au ball bumps 21 formed on chip electrodes 12 by a stud bump method, and a thermoplastic adhesive layer 22 formed on the surface of the semiconductor chip where the chip electrodes 12 of the semiconductor chip are formed. The Au ball bumps 21 are so formed that their head parts may project above the surface of the adhesive layer 22. By forming the bumps for electric connection and applying the adhesive resin having an adhesive function on the semiconductor chip, a very reliable bonding can be realized, In addition, a method of forming a wiring pattern by pasting a copper foil on a semiconductor wafer, a multichip module electrically connected by bumps pasted to each other through an adhesive layer, or the like are provided. |
