| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip that utilizes the features of the collective treatment of a wafer, and has a high yield, low costs, and excellent packaging reliability. SOLUTION: This manufacturing method includes a process that puts an adhesive sheet 2 where adhesion is reduced after treatment althrough the adhesion exists before the treatment onto a quartz substrate 1; a process that fixes a plurality of conforming bare chips 3 onto the adhesive sheet 2 while the surface of an Al electrode pad 5 faces down; a process that deposits resin 4 onto an entire surface including the area among the plurality of conforming bare chips 3; a process that performs specific treatment to the adhesive sheet 2 to reduce the adhesive force of the adhesive sheet 2, and peels a pseudo wafer 29 where the conforming bare chips 3 are fixed; and a process that cuts the resin 4 among the plurality of conforming bare chips 3 to separate each conforming chip component 26. In the pseudo wafer 29, the plurality of conforming bare chips 3 where at least the Al electrode pad 5 is provided merely at one surface side are mutually stuck by the resin 4 that continuously covers the area among the conforming bare chips 3 and the back. In the conforming chip component 26, at least the Al electrode pad 5 is provided merely at one surface side, and the entire surface other than one surface is covered with the resin 4. |
