发明名称 MANUFACTURING DEVICE OF PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To maximize the enhancement of the operating efficiency of a multilayer circuit board and the production efficiency of the circuit board. SOLUTION: The manufacturing method of the circuit board consists of a for drawing original circuitry. A drawing for original circuitry is executed by a transcription operation on a digital file to input the circuit original drawing in a work station through a file server. An inner/outer layer circuit board constituting means that operations are executed on inner/ outer layer boards by a multihead system of a pen plotter and a multihead, and multiple system of a piezoelectric jet head unit by a control signal from the work station using the circuit original drawing drawn by the drawing means to make a comparison correction the inner/outer layer boards and inner/outer layer circuit boards, are constituted. A solder resist treating means that solder resist is applied on the inner/outer layer circuit boards carried out the operations by the constituting means by the pen plotter and the head unit and the circuit boards are made a comparison correction to treat the solder resist. A marking means that fine wirings and character codes are made operations on the circuit boards subjected to soldering by the pen plotter and the head unit to make a comparison correction the circuit boards and the fine wirings and the character codes are marked on the circuit boards. A periodic inspection means that the presence or absence of a defect in the circuit boards completed the marking is inspected while the circuit boards are compared with the circuit original drawing.
申请公布号 JP2001308545(A) 申请公布日期 2001.11.02
申请号 JP20000378087 申请日期 2000.12.12
申请人 YOSHI KOBUNSHI:KK;NIRECO CORP 发明人 CHO HEIYU;JO SAI
分类号 H05K3/28;H05K1/02;H05K3/00;H05K3/06;H05K3/14;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/28
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