| 摘要 |
PROBLEM TO BE SOLVED: To reduce vibration at a mechanism part for sucking and conveying a semiconductor pellet. SOLUTION: This die bonder is composed of a mount arm 3 that sucks and retains the semiconductor pellet, a follower slider block 2 where the mount arm 3 is mounted, a horizontal-direction slider 21 that drives a follower slider 4 that is composed of the follower slider block 2 and the mount arm 3 in a Y (horizontal) direction, a main slider 1 that drives the follower slider 4 in a Z direction, and an optical system 20 for recognition consisting of an optical axis conversion prism 7, a lens 6, and a camera 5 for recognition. The main slider 1 is interlocked to the follower slider 4 at a connection part 8. In the die bonder, a center of gravity 10 in the main slider 1, center of gravity 11 in the follower slider 4, and the connection part 8 are positioned on a driving input shaft (1 shaft) 9. Also, the optical system 20 for recognition is horizontally provided, arid the optical axis conversion prism 7 is arranged at the tip part of the optical system 20. |
