发明名称 WIRE BONDING APPARATUS AND METHOD OF ADJUSTING SERVO USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a wire bonding apparatus which can reduce the residual vibration at the top end of a horn when bonded. SOLUTION: An XY stage 4 which is a movable section when bonding is provided with an X-axis guide 8 and a Y-axis guide 9. The XY stage 4 is guided by these guide members. The XY stage is driven in the X-axis and Y-axis directions by an X-axis motor 11 and a Y-axis motor 12. A head 3 fixed to the XY stage 4 is installed with the horn 1 through a rotary supporting section, and a capillary 2 is installed at the top end of the horn 1. A displacement sensor 5 for measuring the residual vibration in the X-axis direction is installed in a movable section of a sensor driving section 6 fixed to a base 10. When adjusting a servo gain in the X-axis direction, the displacement sensor 5 measures the residual vibration at the top end of the horn 1 when the horn 1 is stopped after being moved in the X-axis direction by the XY stage 4.
申请公布号 JP2001308136(A) 申请公布日期 2001.11.02
申请号 JP20000125058 申请日期 2000.04.26
申请人 NEC CORP 发明人 YAMAGUCHI TOSHIAKI
分类号 G12B5/00;H01L21/60;H01L21/607 主分类号 G12B5/00
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