| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device capable of making a manufacturing cost inexpensive by reducing the man-hours for attaching a semiconductor chip and a radiation plate. SOLUTION: Only each semiconductor chip 2 is divided by sticking a wafer forming a plurality of the semiconductor chips on a dicing sheet 9, which is extended by (c). A radiation disk 14 of size larger than the whole contour of the assemblage of the semiconductor chip is stuck on the semiconductor chip 2 widened while an extending former position is held similar. When divided into the radiation plates 3 of individual size by (d), a semiconductor device having one semiconductor chip and one radiation plate larger than the semiconductor chip can be manufactured in batch processing of a wafer unit. In addition, a multi-modular semiconductor device having the four semiconductor chips and one radiation plate larger than the size of the four semiconductor chips arranged can be manufactured. |
