| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing solder terminals which can form the solder terminals with leadless solder also on an element or a wiring board having steps at a high connection reliability, without short-circuiting fine electrodes. SOLUTION: The method comprises a step of applying flux on the entire surface or a part of a substrate including pad electrodes, step of depositing solder grains onto the flux, step of melting the solder grains to form solder terminals on the pad electrodes, and step of removing the flux and solder remaining other parts than the pad electrodes.
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