| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a Peltier module, gets thermal stress concentrated and reliability deteriorated during use when a thermoelement and an electrode are mechanically retained with solder and the like. SOLUTION: One end surface of a thermoelement 1 is mechanically retained using solder 4 for electric connection to a conductive electrode 2 while the other end surface is electrically connected in pressure contact with a facing electrode extension part 2a. So, related to the thermoelement 1, one end surface is not mechanically retained to an electrode extension part 2a, and thermal stress is dispersed by slip of the thermoelement 1 at a pressed part and deflection at the electrode extension part 2a.
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