发明名称 THREE-DIMENSIONAL PACKAGING PART AND ITS MANUFACTURING METHOD AND OPTICAL TRANSFER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide three-dimensional packaging parts having high packaging density, a method for manufacturing the three-dimensional packaging parts, and an optical transfer device. SOLUTION: The manufacturing method of the three-dimensional packaging parts includes a process where a plurality of electronic components 30 are arranged in a plurality of dies 10, wiring 20 is bonded to the die 10, the electronic components 30 and the wiring 20 are sealed by a forming material 40, the surface shape of the forming material 40 is machined three-dimensionally by the die 10, the forming material 40 is cured, and the die 10 is released from the forming material 40.
申请公布号 JP2001308119(A) 申请公布日期 2001.11.02
申请号 JP20000120344 申请日期 2000.04.21
申请人 SEIKO EPSON CORP 发明人 MURATA AKIHIRO
分类号 G02B6/42;G02B6/43;H01L21/56;H01L23/52;H01L25/00;H01L25/10;H01L25/11;H01L25/18;H05K1/02;H05K1/18;H05K3/00;H05K3/10;H05K3/20;H05K3/24 主分类号 G02B6/42
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