| 摘要 |
PROBLEM TO BE SOLVED: To improve the radiation and withstand voltage of a tape carrier package mounted with an SOI device. SOLUTION: The tape carrier package and a radiation plate are adhered to the chip rear face of the tape carrier package, the radiation plate physically fixes the chip rear face mounted on the tape carrier package, in addition, the tape carrier package arranges a wiring electrode face on the chip rear face and the tape carrier package on the same plane, is electrically connected on the radiation plate, the wiring electrode face and the radiation plate are electrically made same potential, furthermore, the electrode adhering the wiring electrode face to the radiation plate is largely taken as compared with a normal wiring electrode, and the chip rear face is connected to a ground potential. |
