| 摘要 |
PROBLEM TO BE SOLVED: To eliminate difference in the adhesiveness of a resin to a substrate due to a variation in the standby time from the end of development to a heating step and to provide a stable patterning method. SOLUTION: In the patterning method, a photosensitive heat-resistant resin precursor is applied on a substrate, dried, patternwise exposed, developed, subjected to heat treatment 1 at 50-200 deg.C for a short time within 5 hr after the development and further subjected to heat treatment 2 at 250-450 deg.C. |
