| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for removing parts from substrate by which parts can be removed easily and surely from a substrate. SOLUTION: The parts removing device 10 which is used for removing parts P1 and P2 mounted on a substrate 100 from the substrate 100 is provided with a substrate holding section 12 which attachably/detachably holds the substrate 100, a heat supplying section 14 which melts the solder electrically fixing the terminals of the parts P1 and P2 by supplying heat to the substrate 100 side, and a positioning section 16 which positions the heat supplying section 14 to a desired position on the substrate 100 held by means of the substrate holding section 12.
|
