METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR-MANUFACTURING DEVICE USED THEREFOR

摘要

PROBLEM TO BE SOLVED: To form a module-positioning hole simultaneously when molding a semiconductor chip. SOLUTION: When a semiconductor chip 3 is to be molded, a hole 6 is blocked by a pin 12 that is mounted to an upper mold 11a, and then resin 14 is injected into a mold die 11 to mold the semiconductor chip 3.