METHOD AND DEVICE FOR MANUFACTURING BUMP PARTS MOUNTING BODY

摘要

PROBLEM TO BE SOLVED: To prevent the deformation of a wiring board by the heat applied to a conductive adhesive or solder for heating the adhesive or solder at the time of flip-chip mounting bumps on the wiring board. SOLUTION: The bumps 104 mounted on a wiring board 102 put on a supporting substrate 101 are covered with a flexible partition 106. The bumps 104 are pressed against the wiring board 102 by applying different pressures to both sides of the partition 106. When the conductive adhesive or solder is heated in this state, the bumps 104 are connected to the wiring board 102 with the adhesive or solder.