发明名称 |
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
摘要 |
A polishing fluid comprising a distributed organic phase and a continuous aqueous phase, each phase comprising at least one complexing agent. The aqueous phase also having abrasive particles dispersed therein. Reaction products generated during polishing interact with the aqueous phase complexing agent to form water soluble metallic complexes, the water soluble metallic complexes diffuse to an organic/water interface where they release complexing agent molecules in the aqueous phase and generate metal ions which interact with the organic phase complexing agent to form organometallic complexes. Further disclosed is a polishing method, a semiconductor device and semiconductor device fabrication method utilizing the polishing fluid.
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申请公布号 |
US2001036796(A1) |
申请公布日期 |
2001.11.01 |
申请号 |
US20010894117 |
申请日期 |
2001.06.28 |
申请人 |
LUCENT TECHNOLOGIES, INC. |
发明人 |
MISRA SUDHANSHU;ROY PRADIP KUMAR;CHETLUR SUNDAR SRINIVASAAN;SAXENA VIVEK |
分类号 |
B24B37/04;C09G1/02;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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地址 |
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