| 摘要 |
A test socket (2) for an integrated circuit package (250) includes a base (4) for receiving the package, a pressure application subassembly (8) which is pivotally rotated relative to the base (4), and a latching subassembly (8) which is pivotally rotated relative to the base (4), and a latching subassembly (6, 206) which is pivotally mounted to the opposite end of the base (4). The pressure application subassembly (8) includes a plurality of trusses (110, 300) which pivot at one end about trunnions (30) mounted to the base (4) of the socket (2). The trusses (110, 300) carry spring-loaded rocker arms (112, 212) which hold the integrated circuit package (250) in place. The socket also includes means (600, 700, 800, 900) for aligning the integrated circuit along one edge thereof and about its centerline. |
