发明名称 Multilayer devices formed by multilayer thermal transfer
摘要 A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some instances, the thermal transfer element also includes a light-to-heat conversion (LTHC) layer that can convert light energy to heat energy to transfer the multicomponent transfer unit. Transferring the multicomponent transfer unit to the receptor may include contacting a receptor with a thermal transfer element having a substrate and a multicomponent transfer unit. Then, the thermal transfer element is selectively heated to transfer the multicomponent transfer unit to the receptor according to a pattern to form at least first and second operational layers of a device. Often, when the thermal transfer element includes a LTHC layer between the substrate and the transfer layer, the thermal transfer element can be illuminated with light according to the pattern and the light energy is converted to heat energy to selectively heat the thermal transfer element.
申请公布号 US2001036561(A1) 申请公布日期 2001.11.01
申请号 US20010785721 申请日期 2001.02.16
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 WOLK MARTIN B.;BAUDE PAUL F.;FLORCZAK JEFFREY M.;MCCORMICK FRED B.;HSU YONG
分类号 G02B6/13;B41M3/00;B41M5/26;B41M5/382;B41M5/392;B41M5/395;B41M5/40;B41M5/42;G02B6/122;G02B6/138;G03F7/09;G03F7/095;G03F7/34;H01L21/336;H01L27/32;H01L29/786;H01L51/40;H01L51/50;H01L51/56;H05B33/10;H05B33/12;H05K3/04;H05K3/20;(IPC1-7):H05B33/12;B32B3/00 主分类号 G02B6/13
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